Our COOL LINE is supplemented by two new Single Platelet Powders, HeBoFill® CL-SP 009 and HeBoFill® CL-SP 015. The HeBoFill® COOL LINE includes high-performance boron nitride fillers for plastics as well as innovative thermal management solutions. Plastics are very poor heat conductors, depending on the fillers that specifically dissipate the generated heat. Boron nitride particles form thermal bridges, thereby conducting heat out of the plastic quickly, efficiently and in a controlled manner. In addition, boron nitride is characterised by its electrical insulation properties. This property is especially in demand when electronic parts and components need to be electrically insulated.The two new boron nitride powders have been developed especially for applications requiring a smaller particle size with high in-plane thermal conductivity. Applications include composites that are sprayed or where a limited particle size and low viscosity increase is desired.