Boron Nitride Powder
HeBoFill® CL-ADM 150 is a technically optimised boron nitride powder with a particularly high degree of agglomeration. This Boron Nitride grade has a low specific surface area combined with high crystallinity. Due to a specific agglomeration of large single crystals to agglomerates of medium density, this grade is very well suited as filler and additive in plastics, for increasing the thermal conductivity and keeping the electrical insulation at the same time.
Typical applications
- Filler in plastics to increase the thermal conductivity
- In applications without limitation in particle size
- Liquid systems such as adhesives and potting compounds
- Thermal interface materials, gap fillers
The product highlights
- Very high thermal conductivity
- Increase in through-plane thermal conductivity
- High filling degree possible in the system
- Low viscosity increase
- Good free flowing characteristics due to the granular particle structure
- Electrically insulating
- Flame-retardant effect in plastics
- Minimum tool wear compared to other filler materials
* HeBoFill Cool Line - Agglomerate Density High + D50