HeBoFill® CL-ADH 280

Boron Nitride Powder

HeBoFill® CL-ADH 280 is a technically optimised boron nitride powder with an extremely high degree of agglomeration and high density. This boron nitride grade has a low specific surface area combined with high crystallinity. Due to a specific agglomeration of large single crystals to agglomerates of high density, this quality is particularly suitable as filler and additive in plastics for increasing the thermal conductivity while keeping the electrical insulation at the same time.

Typical applications

  • Filler in plastics to increase the thermal conductivity
  • In applications without limitation in particle size
  • Liquid systems such as adhesives and potting compounds
  • Thermal interface materials, gap fillers

The product highlights

  • Very high thermal conductivity
  • High grade of agglomeration
  • High filling degree possible in the system
  • Low viscosity increase
  • Best free flowing characteristics due to the granular particle structure
  • Electrically insulating
  • Flame-retardant effect in plastics
  • Minimum tool wear compared to other filler materials

* HeBoFill Cool Line - Agglomerate Density High + D50

Did you know:
HENZE BNP develops boron nitride powder in accordance with customer-specific requirements.