HeBoFill® LL-SP 100

Boron Nitride Powder

HeBoFill® LL-SP 100 exhibits high purity and good crystallinity. Its high purity and low density, as well as the high thermal conductivity which is a key boron nitride characteristic, predestines this material for use as a filler in polymers in order to increase their inherently low thermal conductivity, whilst retaining the electrical dielectric properties. As a result of the crystal structure of HeBoFill® LL-SP 100 low to medium filler levels are achievable, which makes it particularly suitable for simple heatsink applications. The extremely low hardness results in lower tool wear during processing in comparison to other fillers such as aluminium oxide, magnesium oxide and further fillers.

Typical applications

  • filler for heat conducting pastes and compounds
  • filler for silicone resins, thermoplastics and thermosets

The product highlights

  • electrically insulating
  • high thermal conductivity
  • high purity
  • large individual crystal sizes
  • median range specific surface area
  • no abraded metal particles in the end-product
  • minimal tool wear in comparison to other fillers due to its extremely low hardness

 

Did you know:
HENZE BNP develops boron nitride powder in accordance with customer-specific requirements.

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