HeBoFill® CL-ADH 100 is a performance-optimized boron nitride powder with exceptionally high agglomerate density and excellent crystallinity combined with a low specific surface area. The targeted agglomeration of large individual crystallites predestines it as an additive for plastics that require high thermal conductivity with electrical insulation.
Its dense particle structure enables high filling levels, which can significantly increase the thermal conductivity of the system. In addition, the agglomerate form ensures that the BN properties are almost isotropic - resulting in improved through-plane conductivity.
With a D50 of 100µm, HeBoFill® CL-ADH 100 can be combined particularly well with other fillers to act as a thermal conductivity booster without affecting the viscosity too much. Like all HeBoFill® products, it reliably protects machines from premature wear thanks to its natural lubricating effect.
Typical areas of application
- Liquid systems such as adhesives and potting compounds
- Thermal interface materials, gap fillers
- Applications without particle size limitation
The product highlights at a glance!
- Very high thermal conductivity
- High degree of agglomeration with high density
- Best flowability
- Low viscosity increase
- High purity
- Enables highest filling levels
- Low specific surface area
- No metal abrasion in the end product
- Minimal tool wear compared to other fillers
* HeBoFill Cool Line – Agglomerate density high + D50