The technology behind foldable mobile phones, tablets, e-mobility is constantly evolving. Today's electronic components achieve maximum performance in the smallest possible installation space. Heat is the main result, which has to be dissipated to increase the components' service life, on the one hand, and to guarantee functional reliability on the other.
Here, boron nitride powder is more in demand than ever before. This is because they are considered the ideal filler for increasing thermal conductivity, found, for example, in plastics. The COOL LINE is absolutely pre-destined for these application scenarios. It was developed and refined specifically for this purpose.
The thermal conductivity can be increased many times over by adding boron nitrides, while at the same time maintaining the electrical insulating effect. Boron nitride powder's excellent lubricating and anti-friction properties ensure a smooth production process during compounding. Compared to other conventional fillers, system wear is reduced to a minimum with the use of the COOL LINE fillers. Saving costs in your production.
A good agglomeration degree reduces the specific surface area, improves flowability and reduces dust formation during dosing.
High filling levels enable a maximum increase in thermal conductivity.
Agglomerates with high strength also withstand high shear forces in the incorporation process and reduce dust formation during dosing.
Very good thermal bridge formation with the dense agglomerates in the plastic matrix.
The increased bulk density enables high filling levels and plenty more.
Extremely low specific surface ensures very high filling levels with a comparatively low viscosity increase.
Very large single crystals enable fast heat transfer and good thermal bridge formation in the plastic matrix, and plenty more.